NVIDIA TSMC first Blackwell wafer US production has achieved a groundbreaking milestone with the successful manufacturing of the first Blackwell chip wafer at TSMC’s Arizona facility on October 17, 2025. NVIDIA CEO Jensen Huang visited the TSMC Phoenix facility to celebrate this historic achievement in domestic chip manufacturing, marking a transformative moment for America’s semiconductor industry.
Jensen Huang TSMC Arizona Visit Celebrates Manufacturing Breakthrough
Jensen Huang called the NVIDIA TSMC first Blackwell wafer US production achievement “a historic moment” during his visit to TSMC’s Fab 21 in Phoenix, Arizona. He emphasized that this represents “the very first time in recent American history that the single most important chip is being manufactured here in the United States.” The semiconductor production America milestone demonstrates that advanced AI chip manufacturing capabilities now exist on US soil with yields matching TSMC’s Taiwan facilities.
The first wafer was produced using TSMC’s 4N fabrication process, a custom 4nm-class node specifically designed for NVIDIA’s requirements. This technical achievement proves that the TSMC Phoenix facility has reached full operational capability for producing the world’s most complex advanced AI chips.
Domestic Chip Manufacturing Strengthens US Semiconductor Supply Chain
The Blackwell GPU production in America represents a crucial step in strengthening the US semiconductor supply chain and reducing dependence on overseas manufacturing. TSMC has invested $165 billion in its Arizona operations, underscoring the strategic importance of establishing cutting-edge domestic chip manufacturing infrastructure. This investment aligns with efforts to secure national technological leadership and create thousands of high-skilled jobs.
The volume production Blackwell milestone demonstrates that American-made AI technology manufacturing is now a reality rather than just an aspiration. Similar to how companies are revolutionizing business automation with AI agents, this manufacturing breakthrough enables the physical infrastructure needed to power next-generation artificial intelligence applications.
AI Chip Manufacturing Process and Future Expansion
While the NVIDIA TSMC first Blackwell wafer US production marks significant progress, the complete manufacturing process requires additional steps. The wafers must currently be shipped to Taiwan for TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging before Blackwell chips are fully completed. However, TSMC signed an agreement with Amkor in October 2024 to establish advanced packaging services at a US facility expected to begin operations in 2026.
NVIDIA plans to produce up to $500 billion worth of AI chip manufacturing infrastructure in the United States within the next four years through partnerships with TSMC, Foxconn, Wistron, Amkor, and SPIL. The company is establishing supercomputer manufacturing plants in Texas, with facilities in Houston and Dallas expected to reach mass production within 12-15 months.
According to the official NVIDIA announcement, these domestic chip manufacturing initiatives will create hundreds of thousands of jobs over the coming decades and establish more than a million square feet of manufacturing space across America.
Impact on AI Technology Development
The semiconductor production America achievement enables faster innovation cycles for artificial intelligence development. Just as breakthroughs in AI cancer research are transforming healthcare, the NVIDIA TSMC first Blackwell wafer US production provides the computational foundation for advancing American-made AI technology across industries.
The Blackwell GPU production capability in the United States ensures that critical AI chip manufacturing infrastructure remains accessible for national security applications, research institutions, and commercial enterprises developing next-generation artificial intelligence solutions.
Future of US Semiconductor Manufacturing
The successful NVIDIA TSMC first Blackwell wafer US production demonstrates that America can compete at the highest levels of semiconductor production. The TSMC Phoenix facility achievement proves that complex advanced AI chips can be manufactured domestically with world-class quality and efficiency.
This milestone in domestic chip manufacturing positions the United States as a leader in the global semiconductor industry while strengthening the US semiconductor supply chain for decades to come. The volume production Blackwell capability represents just the beginning of a broader reindustrialization of American-made AI technology manufacturing infrastructure.
